| 摘要 |
A compact sensor module and methods for forming the same are disclosed herein. In some embodiments, a sensor die is mounted on a sensor substrate. A processor die can be mounted on a flexible processor substrate. In some arrangements, a thermally insulating stiffener can be disposed between the sensor substrate and the flexible processor substrate. At least one end portion of the flexible processor substrate can be bent around an edge of the stiffener to electrically couple to the sensor substrate |
