发明名称 APPARATUS AND METHODS USING HEAT PIPES FOR LINKING ELECTRONIC ASSEMBLIES THAT UNEQUALLY PRODUCE HEAT
摘要 An apparatus includes at least one heat sink and first and second electronic assemblies mounted on the at least one heat sink at respective first and second mounting sites and configured to unequally (e.g., at least partially non-concurrently) produce heat. At least one heat pipe is thermally coupled to the at least one heat sink and extends between locations proximate the first and second mounting sites. For example, the first and second electronic assemblies may be components of respective subsystems of an uninterruptible power supply (UPS), such as a rectifier and a battery converter, that generate heat in an at least partially non-concurrent manner.
申请公布号 WO2015031104(A1) 申请公布日期 2015.03.05
申请号 WO2014US51644 申请日期 2014.08.19
申请人 EATON CORPORATION 发明人 OUGHTON, GEORGE W., JR.;NAVARRO, GEORGE ARTHUR
分类号 H05K7/20 主分类号 H05K7/20
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