| 摘要 |
PROBLEM TO BE SOLVED: To provide a light-emitting element having a semiconductor light-emitting part and a mounting substrate bonded via multiple bumps, which can achieve high light extraction efficiency while ensuring a high shock resistance.SOLUTION: The light-emitting element comprises a semiconductor layer 12, a transparent conductive film 13 laminated on the semiconductor layer 12 and having a refractive index lower than that of a p-type nitride semiconductor layer 123, a low refractive index dielectric film 141 laminated on the transparent conductive film 13 excepting a conduction region C1, an adhesive dielectric film 142 laminated on the low refractive index dielectric film 141, a reflective conductive film 143 bonded to the adhesive dielectric film 142 and conducted to the transparent conductive film 13 in the conduction region C1, and also comprises a p-electrode 16 laminated on the reflective conductive film 143 and multiple bumps P being bonded to the p-electrode 16. The conduction region C1 is provided on the outside of a projection region T1 where the bonding surface of the p-electrode 16 and the bump P is projected onto the transparent conductive film 13. |
