发明名称 ELECTRICAL EQUIPMENT, PRODUCTION METHOD THEREOF AND DESIGN METHOD OF ELECTRICAL EQUIPMENT
摘要 Electrical equipment 1 includes a chassis 2 that has a bottom portion 3 and side portions 4 and 5, a printed circuit board 10 that is stored in the chassis 2 such that one principal surface 10a faces an inner surface 3a of the portion 3, a sealing resin 20 that is filled in internal space S formed by the chassis 2 and the circuit board 10, embeds the circuit board 10, and a flow suppression portion 8 that decreases a drift velocity of the resin 20 pressed into the space S through the resin injection hole 11, and that is provided in at least part of region A from a position immediately below the hole 11 in the inner surface 3a to an inner surface 4a of a side portion 4 closest to the hole 11 out of the side portions 4 and 5.
申请公布号 US2015062845(A1) 申请公布日期 2015.03.05
申请号 US201314376847 申请日期 2013.08.30
申请人 SHINDENGEN ELECTRIC MANUFACTRUING CO., LTD. 发明人 Akashi Tomoya
分类号 H05K3/28;G06F17/50;H05K7/04 主分类号 H05K3/28
代理机构 代理人
主权项 1. Electrical equipment comprising: a chassis that has a bottom portion and a plurality of side portions and is opened upward; a printed circuit board in which a resin injection hole that penetrates in a thickness direction is provided, and that is stored in the chassis such that one principal surface faces an inner surface of the bottom portion; a sealing resin that is filled in an internal space formed by the chassis and the printed circuit board, coats the other principal surface of the printed circuit board and embeds the printed circuit board; and a flow suppression portion that decreases a drift velocity of the sealing resin pressed into the internal space through the resin injection hole before the sealing resin is hardened, and that is provided in at least part of a region from a position immediately below the resin injection hole in the inner surface of the bottom portion to an inner surface of a side portion closest to the resin injection hole among the plurality of side portions.
地址 Tokyo JP