| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a conductive paste for ceramic multilayer circuit board which can suppress occurrence of warpage more effectively, when a conductor circuit is formed by calcining simultaneously with a ceramic green sheet.SOLUTION: A conductive paste is used for formation of the inner layer, surface layer of ceramic multilayer circuit board after calcination, or at least any electrode layer of a via. The conductive paste is produced by an atomization method, and composed of atomized silver flake powder produced by further flaking atomized silver powder having an average grain size in a range of 2-9μm and having a maximum grain size of 40μm or less. The atomized silver flake powder has an average thickness of 1-6μm, and an average flat part long diameter of 4-20μm.</p> |
