COPPER FOIL PROVIDED WITH CARRIER, COPPER-CLAD LAMINATED BOARD, PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

摘要

Provided is a copper foil provided with a carrier, said foil having superior dimensional stability and favorable circuit forming properties. The copper foil provided with a carrier has an ultra-thin copper layer measuring 1 to 9 μm in thickness. A copper-clad laminate incorporating the copper foil provided with a carrier demonstrates a peel strength of 2 to 50 g/cm from the ultra-thin copper layer of the carrier. The number of blisters that occur between the carrier and the ultra-thin copper layer when the copper-clad laminate is heated at 220°C for 4 hours and result in deformation of the outer surface of the ultra-thin copper layer is no more than 20/dm2. The number of pinholes confirmed in the ultra-thin copper layer when the carrier is peeled off from the ultra-thin copper layer after the copper-clad laminate is heated at 220°C for 4 hours is no more than 400/m2.