| 发明名称 |
Semiconductor Devices and Methods of Manufacture Thereof |
| 摘要 |
Semiconductor devices and methods of manufacture thereof are disclosed. In some embodiments, a semiconductor device includes a substrate, and a plurality of contact pads disposed over the substrate. The contact pads are arranged in a ball grid array (BGA), and the BGA includes a plurality of corners. A metal dam is disposed around each of the plurality of corners of the BGA. |
| 申请公布号 |
US2015061127(A1) |
申请公布日期 |
2015.03.05 |
| 申请号 |
US201314015808 |
申请日期 |
2013.08.30 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Chen Yu-Feng;Wu Kai-Chiang;Lu Chun-Lin;Kuo Hung-Jui |
| 分类号 |
H01L23/498;H01L21/56 |
主分类号 |
H01L23/498 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device, comprising:
a substrate; a plurality of contact pads disposed over the substrate, the contact pads being arranged in a ball grid array (BGA), the BGA including a plurality of corners; and a metal dam disposed around each of the plurality of corners of the BGA. |
| 地址 |
Hsin-Chu TW |
