HEAT DISSIPATION POWER DEVICE OF HIGH POWER USING HEAT PIPE

摘要

A heat dissipation power device of high power using a heat pipe includes a substrate which has charge power semiconductor devices and discharge power semiconductor devices which are in parallel, and has a circuit pattern; and heat dissipation heat sinks which combine one of a base part as a flat plate of metallic material with a surface on which each power semiconductor device of the substrate is formed, insert one side of the base part into the closed part of a′U′-shaped heat pipe with a constant distance, and have an Al heat dissipation pin which vertically penetrates at least one heat pipe.