发明名称 |
Honeycomb structure and manufacturing method thereof |
摘要 |
There is disclosed a honeycomb structure capable of using as a catalyst carrier and also suitably functions as a heater by applying a voltage, and where a bonding layer to bond honeycomb segments together is hard to break and an electrical resistance value is hard to rise. The honeycomb structure includes a honeycomb segment bonded body 4 in which a plurality of honeycomb segments 6 are bonded together by a bonding layer 7, and a pair of electrode members 21 disposed on a side surface 5 of the honeycomb segment bonded body 4, each of the pair of electrode members 21 is formed into a band shape extending in an extending direction of cells 2 of the honeycomb segments 6, and in a cross section perpendicular to the extending direction of the cells 2, one electrode member 21 is disposed on an opposite side across the center of the honeycomb segment bonded body 4 to another electrode member 21, and in at least a part of the bonding layer 7, inorganic fibers made of ²-SiC and a metal silicide are included in a porous body where particles of silicon carbide are bound with silicon as a binding material in a state where pores are held among the particles. |
申请公布号 |
EP2784050(A3) |
申请公布日期 |
2015.03.04 |
申请号 |
EP20140161129 |
申请日期 |
2014.03.21 |
申请人 |
NGK INSULATORS, LTD. |
发明人 |
KIKUCHI, YOSHIO;KOBAYASHI, HIROHARU;HIDAKA, KENICHI;KOJIMA, MIYUKI;KOBAYASHI, YOSHIMASA |
分类号 |
C04B37/00;B01D46/24;C04B35/573;C04B38/00 |
主分类号 |
C04B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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