发明名称 |
SEMICONDUCTOR DEVICE FABRICATION METHOD, THERMALLY INSULATED LOAD JIG, AND THERMALLY INSULATED LOAD JIG MOUNTING METHOD |
摘要 |
In a heat insulating load jig 11 of the present invention, a solder material 14 having a melting point or a solidus temperature in a range between a thermal resistance temperature of a semiconductor chip 13 and a temperature 100°C below the thermal resistance temperature is interposed between a circuit board 12 and the semiconductor chip 13; a heat insulating body 17 is placed on an upper side of the semiconductor chip 13 in this state; a metal weight 16 is disposed on the heat insulating body 17; and load is applied to the semiconductor chip 13 while the solder material 14 is melted and solidified. |
申请公布号 |
EP2843692(A1) |
申请公布日期 |
2015.03.04 |
申请号 |
EP20130782144 |
申请日期 |
2013.04.24 |
申请人 |
NISSAN MOTOR CO., LTD |
发明人 |
TANIMOTO, SATOSHI;ZUSHI, YUSUKE;MURAKAMI, YOSHINORI;MATSUI, KOHEI;SATO, SHINJI;FUKUSHIMA, YU |
分类号 |
H01L21/67;H01L21/60;H01L21/68 |
主分类号 |
H01L21/67 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|