发明名称 |
CONDUCTIVE SUBSTRATE USING HYDROGEL AND METHOD FOR FORMING PATTERN THEREOF |
摘要 |
<p>Provided are a method for forming the pattern of a conductive thin film, which can form wire pattern without directly etching a conductive thin film, and a conductive substrate using hydrogel. The method for forming the pattern of a conductive thin film includes: a coating step of forming a hydrogel layer by coating hydrogel on a base substrate; a crease forming step of forming creases on the upper side of the hydrogel layer by expanding the volume of the hydrogel layer; a forming step of forming a conductive thin film by coating the upper surface of the hydrogel layer with nanocarbon or metal nanowire; and a pattern forming step of forming a wire pattern by smoothing the crease of the hydrogel layer through the volume contraction of the hydrogel to divide the conductive thin film.</p> |
申请公布号 |
KR101498186(B1) |
申请公布日期 |
2015.03.04 |
申请号 |
KR20130115767 |
申请日期 |
2013.09.29 |
申请人 |
KOREA ELECTRONICS TECHNOLOGY INSTITUTE |
发明人 |
SHIN, KWON WOO;LEE, KUN HEE |
分类号 |
H01B5/14;H05K1/05 |
主分类号 |
H01B5/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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