| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component mounting method and an electronic component mounting machine capable of reducing a electronic component manufacturing cost. <P>SOLUTION: Electronic component mounting method comprises a component supply process for supplying a plurality of types of electronic components loaded together on a component supply device in un-distinguished state, a detection process for detecting information on type L to H of the electronic components, and a coordinate determination process for distinguishing the type L to H of the electronic components based on the information and determining mounting coordinates BL, BM, and BH on a substrate Bf of the electronic components when the electronic components are mountable on the substrate Bf. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
