发明名称 Silicone resin composition, silicone resin sheet, method for producing silicone resin sheet, and optical semiconductor device
摘要 A silicone resin composition includes (1) an organopolysiloxane having at least two alkenylsilyl groups in one molecule, (2) an organopolysiloxane having at least two hydrosilyl groups in one molecule, (3) a hydrosilylation catalyst, and (4) a curing retarder, wherein the curing retarder contains tetraalkylammonium hydroxide.
申请公布号 US8969910(B2) 申请公布日期 2015.03.03
申请号 US201414186014 申请日期 2014.02.21
申请人 Nitto Denko Corporation 发明人 Katayama Hiroyuki
分类号 C08L83/07;H01L33/56;B32B37/14;C09D183/04;C08L83/04;G02B1/04;H01L23/29;C08K5/19;C08G77/12;C08G77/20 主分类号 C08L83/07
代理机构 Sughrue Mion, PLLC 代理人 Sughrue Mion, PLLC
主权项 1. A silicone resin sheet obtained by molding a silicone resin composition into a sheet, and then semi-curing the sheet, wherein the silicone resin composition comprises: (1) an organopolysiloxane having at least two alkenylsilyl groups in one molecule, (2) an organopolysiloxane having at least two hydrosilyl groups in one molecule, (3) a hydrosilylation catalyst, and (4) a curing retarder, wherein a hydrosilyl group functional group equivalent of the organopolysiloxane having at least two hydrosilyl groups in one molecule is 0.010 to 5 mmol/g, wherein the curing retarder contains tetraalkylammonium hydroxide, and the tetraalkylammonium hydroxide content is 10 to 500 mol relative to 1 mol of the hydrosilylation catalyst, and the silicone resin sheet is semi-cured.
地址 Osaka JP