发明名称 Holder of geometry of solder joints
摘要 <p>The fixing tool for the manufacture of the overlap soldered joint comprises a guide pin (4) anchored to the top plane of the step (1) as a U-shaped with a stepped bottom of the non-wettable material for a given solder for soldering material, wheeby the guide pin (4) extends through a hole in the top of the soldering panel (3).</p>
申请公布号 SK288250(B6) 申请公布日期 2015.03.03
申请号 SK20100005030 申请日期 2010.07.13
申请人 USTAV VYROBNYCH TECHNOLOGII MTF STU 发明人 MARTINKOVIC MAROS;KOLENAK ROMAN
分类号 B23K37/04 主分类号 B23K37/04
代理机构 代理人
主权项
地址