发明名称 Self-locating electronics package precursor structure, method for configuring an electronics package, and electronics package
摘要 An electronics package comprising a plurality of mutually parallel, vertically spaced circuit boards of generally circular configuration and electrically connected by a flex circuit comprising a trunk extending circumferentially around the circuit boards and having a branch extending to each circuit board. An electronics package precursor structure and a method of configuring the electronics package from the precursor structure is also disclosed.
申请公布号 US8971048(B2) 申请公布日期 2015.03.03
申请号 US201313787438 申请日期 2013.03.06
申请人 Alliant Techsystems Inc. 发明人 Lucas James D.;McKellips Christopher A.
分类号 H05K1/00;H05K1/14;H05K3/46 主分类号 H05K1/00
代理机构 TraskBritt 代理人 TraskBritt
主权项 1. An electronics package, comprising: a number of mutually parallel, vertically spaced circuit boards; and a flex circuit comprising a trunk extending circumferentially and including a same number of branches as the number of circuit boards, each branch mechanically and electrically connected to one of the number of circuit boards, further comprising baffles equally spaced along the trunk of the flex circuit, secured to and extending perpendicular to the trunk, each baffle engaged with each circuit board of the number of circuit boards, wherein each circuit board comprises a number of equally circumferentially spaced tabs laterally extending in a major plane of the circuit board, each tab of an outer circuit board engaged with a recess proximate an outer end of a baffle and each tab of an inner circuit board engaged with a slot in a baffle.
地址 Arlington VA US