Method for manufacturing probe card, probe card, method for manufacturing semiconductor device, and method for forming probe

摘要

Provided is a method for manufacturing a probe card which inspects electrical characteristics of a plurality of semiconductor devices in batch. The method includes: a step of forming a plurality of probes, which are to be brought into contact with external terminals of the semiconductor devices, on one side of a board which forms the base body of the probe card; a step of forming on the board, by photolithography and etching, a plurality of through-holes which reach the probes from the other side of the board; a step of forming, in the through-holes, through electrodes to be conductively connected with the probes, respectively; and a step of forming wiring, which is conductively connected with the through electrodes, on the other side of the board.

主权项

1. A method for manufacturing a probe card for inspecting electrical characteristics of a semiconductor device, the method for manufacturing the probe card comprising:
forming a plurality of probes on one surface side of a board, the plurality of probes being brought in contact with external terminals of the semiconductor device; forming a plurality of through-holes in the board extending to the probes from another surface of the board by photolithography and etching; forming through electrodes by growing a material of the through electrodes in the respective through-holes and conductively connecting to the probes in the respective through-holes; and forming a wiring on the other surface side of the board, the wiring being conductively connected to the through electrodes; wherein the through electrodes and the wiring are made of copper based on a plating method; and wherein the through electrodes and the wiring are fabricated integrally with the board.