发明名称 Method for Pattern Measurement, Method for Setting Device Parameters of Charged Particle Radiation Device, and Charged Particle Radiation Device
摘要 An object of the present invention is to provide a method for pattern measurement and a charged particle radiation device in which a pattern formed by using a DSA technique can be very precisely measured and inspected. According to an aspect for achieving the object, a method for pattern measurement or a charged particle radiation device for realizing the measurement is proposed as follows. A charged particle is radiated to a polymer compound used for a self-organization lithography technique, and a specific polymer is considerably contracted as compared to the other polymer among multiple polymers forming the polymer compound. Thereafter, dimensions between multiple edges of the other polymer are measured, based on a signal obtained by scanning a region including the other polymer with the charged particle beam.
申请公布号 US2015357158(A1) 申请公布日期 2015.12.10
申请号 US201414760322 申请日期 2014.01.22
申请人 HITACHI HIGH-TECHNOLOGIES CORPORATION 发明人 SUZUKI Makoto;YAMAGUCHI Satoru;SAKAI Kei;ISAWA Miki;TAKADA Satoshi;HASUMI Kazuhisa;IKOTA Masami
分类号 H01J37/30;H01J37/28 主分类号 H01J37/30
代理机构 代理人
主权项 1. A method for pattern measurement in which dimension measurement is performed for a pattern formed on a sample, based on detection of a charged particle obtained by scanning the sample with a charged particle beam, wherein the charged particle is radiated to a polymer compound used for a self-organization lithography technique, and a specific polymer is considerably contracted as compared to the other polymer among multiple polymers forming the polymer compound, and wherein thereafter, or concurrently with the contraction, dimensions between multiple edges of the other polymer are measured, based on a signal obtained by scanning a region including the other polymer with the charged particle beam.
地址 Minato-ku, Tokyo JP