发明名称 Adhesive tape and solar cell module using the same
摘要 The present invention provides an adhesive tape 10 for electrically connecting a plurality of solar battery cells, which adhesive tape has a metal foil 1 and an adhesive layer 2 composed of an adhesive provided on at least one surface of the metal foil 1, and a solar battery module using the adhesive tape. The adhesive tape of the present invention can suppress the decrease in the product yield and can improve the connection workability of solar battery cells.
申请公布号 US8969707(B2) 申请公布日期 2015.03.03
申请号 US201113222248 申请日期 2011.08.31
申请人 Hitachi Chemical Company, Ltd. 发明人 Fukushima Naoki;Shimizu Takehiro;Fukutomi Takahiro
分类号 H01L31/042;H01L31/05;C09J9/02;C09J163/00;C09J9/00;C09J11/04;H01B1/22;H01L31/0224 主分类号 H01L31/042
代理机构 Griffin & Szipl, P.C. 代理人 Griffin & Szipl, P.C.
主权项 1. A method for producing a solar battery module comprising a plurality of solar battery cells, the method comprising the steps of: (a) providing a plurality of solar battery cells; and (b) electrically connecting the plurality of solar battery cells by using adhesive tapes, wherein each adhesive tape comprises a metal foil, and adhesive layers, each comprising an adhesive, provided on at least one surface of the metal foil, wherein the adhesive comprises a conductive particle and an insulating adhesive composition, wherein the conductive particle includes a gold-plated nickel particle or a gold/nickel-plated plastic particle, wherein the conductive particle is 0.1% to 20% by volume to a total volume of the adhesive, wherein the insulating adhesive composition includes a thermosetting resin, a curing agent for the thermosetting resin and a film forming material, wherein the thermosetting resin is an epoxy resin, wherein the thermosetting resin is 10 to 80% by mass to a total amount of the insulating adhesive composition, wherein the curing agent is 2 to 10% by mass to the total amount of the insulating adhesive composition, wherein the film forming material is a phenoxy resin, wherein a weight-average molecular weight of the phenoxy resin is 10000 to 10000000, and wherein the film forming material is approximately 67% to 80% by mass to the total amount of the insulating adhesive composition, wherein approximately is within the margins of error that are inherent in measuring the mass.
地址 Tokyo JP