| 摘要 |
Various embodiments of methods and systems for adaptive thermal management techniques implemented in a portable computing device (“PCD”) are disclosed. Notably, in many PCDs, temperature thresholds associated with various components in the PCD such as, but not limited to, die junction temperatures, package on package (“PoP”) memory temperatures and the “touch temperature” of the external surfaces of the device itself limits the extent to which the performance capabilities of the PCD can be exploited. It is an advantage of the various embodiments of methods and systems for adaptive thermal management that, when a temperature threshold is violated, the performance of the PCD is sacrificed only as much and for as long as necessary to clear the violation before authorizing the thermally aggressive processing component(s) to return to a maximum operating power. |
| 主权项 |
1. A method for adaptive thermal management in a portable computing device (“PCD”), the method comprising:
defining a discrete number of performance levels for one or more processing components in the PCD, wherein each of the performance levels is associated with a power frequency supplied to the one or more processing components; defining temperature thresholds associated with one or more components in the PCD, wherein each of the one or more components is a junction component, package on package (“PoP”) memory component or outer shell component; monitoring a plurality of temperature sensors in the PCD, wherein each temperature sensor is associated with one of a junction component, package on package (“PoP”) memory component, and outer shell component; receiving an interrupt signal from one of the plurality of temperature sensors, wherein the interrupt signal indicates that an initial temperature threshold has been exceeded; sampling at time based intervals, at a first rate, temperature signals from one or more of the plurality of temperature sensors; receiving a temperature signal indicating that at least one of the temperature thresholds has been violated; reducing the performance level of one or more of the processing components from a maximum performance level to a next highest performance level within the defined discrete number of performance levels; sampling for an additional interval, at the first rate, the temperature signal that indicated that at least one of the temperature thresholds was violated; receiving a temperature signal indicating that the violation of at least one of the temperature thresholds has been cleared; increasing the performance level of the one or more processing components from the next highest performance level to the maximum performance level; prior to increasing the performance level of the one or more processing components from the next highest performance level to the maximum performance level, holding the performance level at the next highest performance level for a penalty period; and after increasing the performance level of the one or more processing components from the next highest performance level to the maximum performance level, either:
increasing the duration for a subsequent penalty period if, during a reset period, a temperature signal is received indicating that the at least one of the temperature thresholds has been violated; orresetting the duration for a subsequent penalty period to a default duration if, during a reset period, no temperature signal is received indicating that the at least one of the temperature thresholds has been violated. |
