| 发明名称 | Packages with molding material forming steps | ||
| 摘要 | A package includes a first package component having a top surface, a second package component bonded to the top surface of the first package component, and a plurality of electrical connectors at the top surface of the first package component. A molding material is over the first package component and molding the second package component therein. The molding material includes a first portion overlapping the second package component, wherein the first portion includes a first top surface, and a second portion encircling the first portion and molding bottom portions of the plurality of electrical connectors therein. The second portion has a second top surface lower than the first top surface. | ||
| 申请公布号 | US8970024(B2) | 申请公布日期 | 2015.03.03 |
| 申请号 | US201313906185 | 申请日期 | 2013.05.30 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Hsu Yu-Chen;Lin Chun-Hung;Chen Yu-Feng;Pu Han-Ping |
| 分类号 | H01L23/02;H01L23/31;H01L21/56;H01L25/00;H01L23/00;H01L25/10;H01L25/065 | 主分类号 | H01L23/02 |
| 代理机构 | Slater & Matsil, L.L.P. | 代理人 | Slater & Matsil, L.L.P. |
| 主权项 | 1. A package comprising: a first package component comprising a top surface; a second package component bonded to the top surface of the first package component; a plurality of electrical connectors at the top surface of the first package component; and a molding material over the first package component and molding the second package component therein, wherein the molding material comprises: a first portion overlapping the second package component, wherein the first portion comprises a first top surface; anda second portion encircling the first portion and molding bottom portions of the plurality of electrical connectors therein, wherein the second portion comprises a second top surface lower than the first top surface, with the first top surface and the second top surface having a same surface roughness. | ||
| 地址 | Hsin-Chu TW | ||