发明名称 Printed circuit board radio-frequency shielding structures
摘要 Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, a radio-frequency shielding structure may be mounted over the electrical components. The radio-frequency shielding structure may be formed from a printed circuit that includes a ground plane such as a flex circuit or rigid printed circuit board that includes at least one blanket layer of metal. The printed circuit board to which the electrical components are mounted may include a recess in which the electrical components are mounted. Additional components may be mounted to the interior and exterior surface of the radio-frequency shielding structure. The radio-frequency shielding structure may be formed from a flex circuit that has slits at its corners to accommodate folding.
申请公布号 US8969737(B2) 申请公布日期 2015.03.03
申请号 US201213632908 申请日期 2012.10.01
申请人 Apple Inc. 发明人 Just Andrew B.;Weber Trent;Honjo Shigefumi
分类号 H05K9/00;H05K1/02;H05K1/14;H05K1/18 主分类号 H05K9/00
代理机构 Treyz Law Group 代理人 Treyz Law Group ;Treyz G. Victor;Woodruff Kendall P.
主权项 1. Apparatus, comprising: an electronic component mounted to a substrate; and a radio-frequency shield for the electronic component that is formed from a non-planar layer of polymer coated with a layer of metal, wherein the non-planar layer of polymer coated with the layer of metal has a substantially rectangular shape with corner slits, and wherein the corner slits are filled with a conductive material.
地址 Cupertino CA US