PLASMA SURFACE PROCESSOR AND PLASMA SURFACE PROCESSING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a plasma surface processing technique capable of uniformly reforming the whole surface of a long material and freely coping with plasma treatment in which atmosphere control is required.SOLUTION: A plasma surface processor includes: a chamber 1 in which a dielectric body is formed in a pipe shape; an inner electrode 2 which is formed over the whole circumference of the inner peripheral surface of the chamber 1; an outer electrode 3 which is formed over the whole circumference of the outer peripheral surface of the chamber; a voltage application means 4 for applying a voltage to the inner electrode 2 and the outer electrode 3 to generate plasma by dielectric barrier discharge; and an atmosphere gas introduction means 6 for introducing atmosphere gas into the chamber from openings 5 formed right and left ends of the chamber 1.