| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer circuit board capable of improving alignment accuracy, increasing a wiring density of circuit layers and downsizing the design of a bonding pad between a conductive via and a bottom layer.SOLUTION: The manufacturing method of the multilayer circuit board includes following steps. Namely, first of all, a board is provided which includes two surfaces opposing each other and a via connected between the surfaces. Next, while using the via as an alignment target, a patterned circuit layer is formed on each surface. Each of the patterned circuit layers includes a concentric pattern. Next, a first laminate is formed on each surface. Then, a first through hole is formed that penetrates a region where a first concentric circle is orthographically projected from a center of the concentric pattern to the first laminate and the board. Next, a second laminate is formed on each of the first laminates. Then, a second through hole is formed which penetrates a region where a second concentric circle is orthographically projected from the center of the concentric pattern to the first laminate, the second laminate and the board.</p> |
