发明名称 PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
摘要 The present invention provides a plasma processing apparatus and a plasma processing method. The present invention ignites plasma stably, and also prevents insulation damage to a dielectric member. The plasma processing apparatus includes: dielectric members (4, 5) which demarcate a chamber (7); a gas introduction unit (11) which introduces gas within the chamber (7); a coil for discharge (3) installed in one side of the dielectric member (4) and which generates the plasma within the chamber (7) in which the gas is introduced by receiving AC power; a conductive member (13) which is disposed on the other side of the dielectric member (5) and is faced with the coil for discharge (3) across the chamber (7) of the dielectric members (4, 5); the AC power which supplies the AC power to the coil for discharge (3); an opening unit (8) which is penetrated within the chamber (7) and irradiates the plasma for a base material (1); and a moving tool (50) which moves the base material (1) for the chamber (7) to cross the front of the base material (8). The coil for discharge (3) is grounded or connected to the conductive member (13) by penetrating a capacitor for voltage generation (24) or a coil for voltage generation (25).
申请公布号 KR20150021440(A) 申请公布日期 2015.03.02
申请号 KR20140070658 申请日期 2014.06.11
申请人 PANASONIC CORPORATION 发明人 OKUMURA TOMOHIRO
分类号 H05H1/24;H05H1/30;H05H1/46 主分类号 H05H1/24
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