发明名称 BONDING METHOD USING ADHESIVE TAPE AND PORTABLE ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To improve yield and easiness of recycling of an adhesive tape, secure waterproofness, and obtain sufficient bond strength between a display panel and a housing when the display panel and the housing are bonded.SOLUTION: A plurality of adhesive tapes 1 and 2 are arranged to make a frame corresponding to the peripheral part of a display panel 101. After performing any of facing ends of these adhesion tapes 1 and 2 with each other, superimposing the ends of these adhesion tapes with each other, and filling a gap formed between the ends of these adhesive tapes with the same material as the adhesive tape, an adhesive layer is softened or melted by heating with a laser beam.
申请公布号 JP2015041072(A) 申请公布日期 2015.03.02
申请号 JP20130173505 申请日期 2013.08.23
申请人 HAYAKAWA RUBBER CO LTD 发明人 YAMADA KOSAKU;MURAKAMI HIROBUMI;FUJITA KAZUYA
分类号 G09F9/00;C09J7/02 主分类号 G09F9/00
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