接合体之制造方法及功率模组用基板之制造方法;METHOD OF JOINTED BODY, AND METHOD OF PRODUCING SUBSTRATE FOR POWER MODULE

摘要

该功率模组用基板之制造方法具备隔着活性金属材及熔点为710℃以下之焊填材，叠层陶瓷构件(11)和铜构件(12)之叠层工程，和对被叠层之陶瓷构件(11)及铜构件(12)进行加热处理的加热处理工程。 The method of producing a substrate for a power module, includes the steps of: layering a copper member (12) on a ceramics member (11) via an active metal and a welding material of which the melting point is 710℃; and heat-treating the ceramics member (11) and the copper member (12) layered on the ceramics member.