晶片封装体及其形成方法;CHIP PACKAGE AND METHOD FOR FORMING THE SAME

摘要

本发明一实施例提供一种晶片封装体及其形成方法。晶片封装体包括：一图案化导电板，具有彼此电性隔离之复数个导电部分；复数个导电垫，设置于该图案化导电板之一上表面之上；一晶片，设置于该些导电垫之上；复数个导电凸块，设置于该图案化导电板之一下表面之上，其中每一该些导电凸块电性连接至该图案化导电板之该些导电部分之对应的其中之一；以及一绝缘支撑层，部分围绕该些导电凸块。本发明之晶片封装体及其形成方法可显着地降低晶片封装体的制作成本。; a plurality of conducting pads disposed on an upper surface of the patterned conducting plate; a chip disposed on the conducting pads; a plurality of conducting bumps disposed on a lower surface of the patterned conducting plate, wherein each of the conducting bumps is electrically connected to a corresponding one of the conducting sections of the patterned conducting plate; and an insulating support layer partially surrounding the conducting bumps.