半导体封装件及其制法;SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

一种半导体封装件及其制法，该半导体封装件之制法系包括：提供第一封装基板及第二封装基板，该第一封装基板具有复数第一电性接触垫及形成其上的第一金属柱，该第二封装基板具有复数第二电性接触垫、形成其上之第二金属柱及设于该具有第二电性接触垫之表面上的半导体晶片；接置该第一封装基板于该第二封装基板的第二金属柱上，该第一封装基板系以其复数第一电性接触垫上的第一金属柱对应电性连接该第二金属柱；以及于该第一封装基板与第二封装基板之间形成包覆该第一金属柱与第二金属柱的封装胶体。本发明能有效避免半导体封装件之焊料桥接现象，进而增进产品良率与可靠度。; connectedly disposing the first package substrate on the second metal column of the second package substrate, wherein the first package substrate electrically connects the second metal columns by corresponding to the first metal columns of the plurality of first electrical contact pads; and forming a package colloid provided in between the first package substrate and the second package substrate for covering the first metal column and the second metal column. The present invention can effectively prevent the solder bridging phenomenon of semiconductor package, so as to improve product yield and reliability.