| 摘要 |
In one aspect of the disclosure, a system for processing a location of a workpiece is disclosed. The system includes a tool, including a first passage, configured to supply a vacuum to the location, and a second passage formed along the first passage, where the second passage is configured to supply a fluid to the location. The system also includes means for rotating and selectively axially vibrating the tool, means for supplying the fluid to the tool, and means for supplying the vacuum to the tool. |
