SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

摘要

A method for fabricating a semiconductor package is disclosed, which includes: providing first and second packaging substrates, wherein a surface of the first packaging substrate has first conductive pads and first conductive posts formed on the first conductive pads, a surface of the second packaging substrate has second conductive pads and second conductive posts formed on the second conductive pads, and the surface of the second packaging substrate further has a semiconductor chip disposed thereon; disposing the first packaging substrate on the second packaging substrate in a manner that the first conductive posts correspond in position to and are electrically connected to the second conductive posts; and forming an encapsulant between the first and second packaging substrates for encapsulating the first and second conductive posts and the semiconductor chip, thereby effectively preventing solder bridging and increasing the product yield and reliability.

主权项

1. A method for fabricating a semiconductor package, comprising the steps of:
providing a first packaging substrate having opposite first and second surfaces and a second packaging substrate having opposite third and fourth surfaces, wherein the first surface of the first packaging substrate has a plurality of first conductive pads and a plurality of first conductive posts formed on the first conductive pads, the third surface of the second packaging substrate has a plurality of second conductive pads and a plurality of second conductive posts formed on the second conductive pads, and the third surface of the second packaging substrate further has a semiconductor chip disposed thereon; disposing the first packaging substrate on the second packaging substrate in a manner that the first conductive posts correspond in position to and are electrically connected to the second conductive posts; and forming an encapsulant between the first packaging substrate and the second packaging substrate for encapsulating the first conductive posts, the second conductive posts and the semiconductor chip.