发明名称 DEVICE STRUCTURE FOR REDUCING LEAKAGE CURRENT OF SEMICONDUCTOR DEVICES WITH FLOATING BURIED LAYER
摘要 A device structure is provided to reduce the leakage current of semiconductor devices with a floating buried layer (FBL), includes a substrate, a first epitaxial layer, a split floating buried layer, a second epitaxial layer, a doped trench, a protected device, a surface junction termination extension (S-JTE) and a scribe street. The device and the S-JTE are designed at the second epitaxial layer and the split floating buried layer at the joint of the first and second epitaxial layers. The doped trench is penetrated through the second epitaxial layer and connected to the split floating buried layer. The substrate, the first and second epitaxial layers feature the same typed doping which is opposite to that of split floating buried layer and doped trench.
申请公布号 US2015054119(A1) 申请公布日期 2015.02.26
申请号 US201414463657 申请日期 2014.08.19
申请人 China Electronic Technology Corporation, 24th Research Institute 发明人 TAN KAI-ZHOU;TANG ZHAO-HUAN;LIU RONG-KAN;LIU YONG
分类号 H01L29/06 主分类号 H01L29/06
代理机构 代理人
主权项 1. A device structure for reducing leakage current of semiconductor devices with a floating buried layer, comprising: a semiconductor substrate, a first epitaxial layer, a split floating buried layer, a second epitaxial layer, a doped trench, a protected device, a surface junction termination extension (S-JTE) and a scribe street.
地址 Chongqing City CN