SEMICONDUCTOR LIGHT EMITTING DEVICE AND MULTIPLE LEAD FRAME FOR SEMICONDUCTOR LIGHT EMITTING DEVICE

摘要

A semiconductor light emitting device that is excellent in radiating heat and that can be molded into a sealing shape having intended optical characteristics by die molding is provided. The semiconductor light emitting device includes: a lead frame including a plate-like semiconductor light emitting element mounting portion having an LED chip mounted on a main surface, and a plate-like metal wire connecting portion extending over a same plane as the semiconductor light emitting element mounting portion; a metal wire electrically connecting the LED chip and the metal wire connecting portion; a thermosetting resin molded by die molding or dam-sheet molding so as to completely cover the LED chip and the metal wire; and a resin portion provided to surround the lead frame and having the thickness not greater than the thickness of the lead frame.

主权项

1. A light emitting device, comprising:
an LED chip; a first lead including a top surface having a concave surface on which said LED chip is mounted, and a bottom surface exposed to an external; a second lead including a top surface, and a bottom surface exposed to the external; a metal wire electrically connecting said LED chip and the top surface of said second lead; a resin dome for covering said LED chip and said metal wire, the end of said resin dome being located outside the concave surface; and an insulator provided so as to surround said first and second leads and provided between said first and second leads.