发明名称 METHOD OF MANUFACTURING TOUCH DEVICES
摘要 A method of manufacturing touch devices comprises the steps of cutting a large-sized substrate into a plurality of even units and then performing the subsequent machining processes, providing the required materials of each structure layer, layer by layer, via sputtering or coating, and then simultaneously forming each structure layer via processes such as photolithography, developing, and etching. Therefore, the manufacturing cost is significantly reduced and the structure strength is substantially enhanced.
申请公布号 US2015053639(A1) 申请公布日期 2015.02.26
申请号 US201313973977 申请日期 2013.08.22
申请人 Lin Chih-Chung 发明人 Lin Chih-Chung
分类号 G06F3/045 主分类号 G06F3/045
代理机构 代理人
主权项 1. A method of manufacturing touch devices, including the steps of: providing a substrate and cutting the substrate into a plurality of even units; modifying an edge of each of the units via mechanical machining; strengthening a surface of the each of the units; defining a touch area and a non-touch area on the surface of the each of the units and disposing a mask layer on the non-touch area; disposing a touch electrode layer having a plurality of touch electrodes on the touch area and the non-touch area of the each of the units; covering the touch electrode layer with a metal mask, forming an upper metal path layer on a part uncovered by the metal mask on the non-touch area, and then removing the metal mask; forming the touch electrodes on the touch electrode layer and forming a plurality of upper metal paths on the upper metal path layer via processes including an etching process; disposing an insulated layer on junctions of the touch electrodes and the upper metal paths, the insulated layer reserving a plurality of electrical connecting holes; disposing a lower metal path layer having a plurality of lower metal paths on the insulated layer, electrically connecting the upper metal paths and the touch electrodes via the electrical connecting holes, and electrically connecting the upper metal paths and the lower metal paths via electrical connecting holes; and disposing a passivation layer on the touch electrode layer, the lower metal path layer, and the insulated layer.
地址 Taipei City TW