| 摘要 |
This method for manufacturing an optical interferometer is provided with: a first step for forming a first semiconductor section for a beam splitter, and a second semiconductor section for a movable mirror, said first semiconductor section and second semiconductor section being formed on a main surface of a supporting substrate, and a first insulating layer formed on the main surface; a second step for disposing a first wall section between a first side surface of the first semiconductor section, and a second side surface of the second semiconductor section; and a third step for forming a mirror surface on the second semiconductor section by forming a first metal film on the second side surface using a shadow mask. In the third step, the first side surface is masked by means of a mask section and the first wall section, and in a state wherein the second side surface is exposed from an opening, the first metal film is formed. |
