| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology of fixing an optical component to a sensor chip at high accuracy.SOLUTION: A semiconductor device manufacturing method comprises: after mounting a sensor chip 3 provided with a surface 3a having a sensor surface on which a plurality of light receiving elements are formed, face up on a wiring board 2, arranging adhesive materials at a plurality of places on the surface 3a of the sensor chip 3 to form a plurality of adhesive spacers SP1 by curing the adhesive materials; arranging paste adhesive materials 11a on the surface 3a of the sensor chip 3; arranging an optical component 5 held by a bonding tool 23 on the surface 3a of the sensor chip 3 via the spacers SP1 and the adhesive materials 11a; and subsequently, fixing the optical component 5 by removing the bonding tool 23 from the optical component 5 and curing the adhesive materials 11a without applying a load to the optical component 5. |
