METHOD FOR MANUFACTURING TERMINAL-STRIP-EQUIPPED ELECTRONIC COMPONENT AND TERMINAL-STRIP-EQUIPPED ELECTRONIC COMPONENT

摘要

A method for manufacturing a terminal-strip-equipped electronic component in which terminal strips made of a metal plate are bonded with solder to terminal electrodes of an electronic chip component on two opposing end surfaces. Solder cream is applied to outer surfaces of the terminal electrodes. The terminal strips are thermocompression bonded to the terminal electrodes by placing the electronic chip component between the terminal strips and pressing the terminal strips against the terminal electrodes using a pair of heating elements so as to obtain an electronic component to which the terminal strips are temporarily fixed. The terminal strips are fully fixed to the electronic component by melting the solder cream as a result of heating the electronic component in a heating furnace so as to obtain a terminal-strip-equipped electronic component.

主权项

1. A method for manufacturing a terminal-strip-equipped electronic component, comprising:
a first step of preparing an electronic chip component including terminal electrodes on two opposing end surfaces; a second step of preparing a pair of terminal strips made of a metal plate; a third step of applying solder cream to outer surfaces of the terminal electrodes or inner surfaces of the terminal strips; a fourth step of thermocompression bonding the terminal strips to the terminal electrodes by placing the electronic chip component between the terminal strips and pressing the terminal strips against the terminal electrodes using a pair of heating elements so as to form an electronic component to which the terminal strips are temporarily fixed; and a fifth step of fully fixing the terminal strips to the electronic component by heating the electronic component to which the terminal strips are temporarily fixed in a heating furnace and melting the solder cream so as to obtain a terminal-strip-equipped electronic component.