| 发明名称 |
Electronic package structure and method for making the same |
| 摘要 |
An inductive component is disclosed. The inductive component comprises a magnetic body and a coil in the magnetic body, wherein a first protrusion and a second protrusion are formed on the bottom surface of the magnetic body, wherein the first protrusion comprises a first electrode disposed on the peak surface of the first protrusion, and the second protrusion comprises a second electrode disposed on the peak surface of the second protrusion, wherein the first electrode and the second electrode are electrically connected to a first end and a second end of the coil, and a space is formed by the first protrusion, the second protrusion and the bottom surface of the magnetic body for accommodating electronic devices. |
| 申请公布号 |
US2015055315(A1) |
申请公布日期 |
2015.02.26 |
| 申请号 |
US201414532021 |
申请日期 |
2014.11.04 |
| 申请人 |
CYNTEC CO., LTD. |
发明人 |
Lu Bau-Ru;Chiang Kai-Peng;Chen Da-Jung;Wu Tsung-Chan |
| 分类号 |
H01F27/30;H01L23/495;H01L23/64;H01F27/29 |
主分类号 |
H01F27/30 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An inductive component comprising a magnetic body and a coil in the magnetic body, wherein a first protrusion and a second protrusion are formed on the bottom surface of the magnetic body, wherein the first protrusion comprises a first electrode disposed on the peak surface of the first protrusion, and the second protrusion comprises a second electrode disposed on the peak surface of the second protrusion, wherein the first electrode and the second electrode are electrically connected to a first end and a second end of the coil, and a space is formed by the first protrusion, the second protrusion and the bottom surface of the magnetic body for accommodating at least one electronic device. |
| 地址 |
Hsinchu TW |
