发明名称 INTEGRATED CIRCUIT WITH INTERRUPTED SEAL RING
摘要 <p>The amount of signal propagation and moisture penetration and corresponding reliability problems due to moisture penetration degradation in an IC can be reduced by fabricating a wide seal ring with a channel having offset ingress and egress portions.</p>
申请公布号 EP2342746(B1) 申请公布日期 2015.02.25
申请号 EP20090793254 申请日期 2009.10.01
申请人 QUALCOMM INCORPORATED 发明人 FREDERICK JR., NORMAN;MYERS, TOM
分类号 H01L23/00;H01L23/58 主分类号 H01L23/00
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