| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To allow a multilayer circuit board to be manufactured at a low cost without using a mold. <P>SOLUTION: A substrate 10 comprises a resin layer 11 and a multistep conductive part 12 which is formed on a surface of the resin layer 11 and has steps. A step surface 12b of the multistep conductive part 12 is substantially parallel to the outermost surface 10a of the resin layer 11. An interlayer connection via 12c closer to the tip side than the step surface 12b is formed of a metal foil 101. Pattern wiring 12d closer to the outermost surface 10a side of the resin layer 11 than the step surface 12b is formed by plating. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
