| 摘要 |
<p>The present invention relates to a semiconductor package inspection method using a test handler. The method includes the steps of: using a first loading picker to move a semiconductor package stored in a customer tray to a load waiting unit; using a second loading picker to move the semiconductor package on the load waiting unit to a load moving unit and aligning the semiconductor package by using a vision; conduction an inspection by moving the semiconductor package to an inspection package from the load moving unit; moving the semiconductor package completed with the inspection to an unload moving unit; using a first unloading picker to move the semiconductor package to the unload waiting unit from the unload moving unit; and moving the semiconductor package by using a second unloading picker to the customer tray based on the inspection result.</p> |
