| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a soldering method capable of achieving excellent connection between a pad and a conductive wire.SOLUTION: Disclosed is a soldering method in which a conductive wire 21 is placed on a pad 3 having a solder ball 12 provided thereon, and the conductive wire 21 is soldered to the pad 3 by melting the solder ball 12. The pad 3 includes a first area 32 where the conductive wire 21 is placed, and a second area 33 where the solder ball 12 is provided. The first area 32 and the second area 33 are provided independently from each other.</p> |
