| 发明名称 | Method of manufacturing circuit board, method of manufacturing electronic device, and electronic device | ||
| 摘要 | A method of manufacturing a circuit board includes forming a first electrode on a support substrate, covering the support substrate and the first electrode with a first insulating layer, polishing the first insulating layer to expose a first surface of the first electrode, forming a first wiring on the first insulating layer after exposing the first surface of the first electrode, the first wiring being connected to the first electrode, and removing the support substrate to expose a second surface of the first electrode after forming the first wiring. | ||
| 申请公布号 | US8959758(B2) | 申请公布日期 | 2015.02.24 |
| 申请号 | US201213426874 | 申请日期 | 2012.03.22 |
| 申请人 | Fujitsu Limited | 发明人 | Arai Kazuya;Ikegami Shinpei;Suzuki Hitoshi;Fukui Kei |
| 分类号 | H05K3/00;H01L21/48;H05K3/46;H01L23/498;H01L23/00;H05K1/11 | 主分类号 | H05K3/00 |
| 代理机构 | Squire Patton Boggs (US) LLP | 代理人 | Squire Patton Boggs (US) LLP |
| 主权项 | 1. A method of manufacturing a circuit board, the method comprising forming a first electrode on a support substrate; covering the support substrate and the first electrode with a first insulating layer; polishing the first insulating layer to expose a first surface of the first electrode; forming a first wiring on the first insulating layer after exposing the first surface of the first electrode, the first wiring being connected to the first electrode; and removing the support substrate to expose a second surface of the first electrode after forming the first wiring. | ||
| 地址 | Kawasaki JP | ||