Method of manufacturing an electronic module

摘要

In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.

主权项

1. A method of manufacturing an electronic module, comprising:
providing a substrate having a component portion wherein the component portion includes a component area on a surface of the substrate, and a plurality of metallic layers that extend along a periphery of the component portion wherein the plurality of metallic layers are coupled to one another; providing an electronic component on the component area; providing an overmold over the surface to cover the component area; forming an opening through at least the overmold that exposes at least a section of one of the plurality of metallic layers along the periphery of the component portion; and applying an electromagnetic shield material over the overmold and within the opening to form an electromagnetic shield over the component area that is coupled to at least the section of the one of the plurality of metallic layers.