| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid state image pickup device which favorably functions after a film thinning process even when laminated semiconductor chips have different sizes; and provide a manufacturing method of the solid state image pickup device.SOLUTION: A solid state image pickup device 1 of the present embodiment comprises: a first chip 10 having a pixel array 11 in which a plurality of photoelectric conversion parts for converting incident light into electric signals are arranged; a second chip 20 which has an area in planar view smaller than an area of the first chip 10 in planar view and which is electrically and physically connected to the first chip 10; and a support part 30 which is provided to cover an entire region of a surface of the first chip 10, on which the second chip 20 is connected and except a region covered with the second chip 20, for supporting the first chip 10 to maintain flatness of the first chip 10. |
