| 摘要 |
<p>The embodiment of the present invention relates to a light emitting device package and a lighting system. The light emitting device package according to the embodiment of the present invention includes a package body, a groove which is formed on the upper side of the package body, and a light emitting device which includes a bonding pad and is arranged on the package body. At least part of the bonding pad of the light emitting device is located in the groove.</p> |
