发明名称 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method capable of achieving excellent substrate processing while suppressing the consumption amount of process liquid.SOLUTION: A substrate processing apparatus 1 includes: a reservoir part 2 having an opening 2a on the top surface and storing process liquid therein; a holding part 3 for holding a substrate W having a processing object surface Wa so as to close the opening 2a by directing the reservoir part 2 to the processing object surface Wa; and a supply part 5 for supplying the process liquid to a position in the reservoir part 2, which is in contact with the processing object surface Wa of the substrate W held by the holding part 3.</p>
申请公布号 JP2015037126(A) 申请公布日期 2015.02.23
申请号 JP20130168403 申请日期 2013.08.13
申请人 SHIBAURA MECHATRONICS CORP 发明人 MATSUSHIMA DAISUKE;DEMURA KENSUKE;SUZUKI MASAFUMI;SASAHIRA KONOSUKE
分类号 H01L21/027;H01L21/304;H01L21/306 主分类号 H01L21/027
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