发明名称 |
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method capable of achieving excellent substrate processing while suppressing the consumption amount of process liquid.SOLUTION: A substrate processing apparatus 1 includes: a reservoir part 2 having an opening 2a on the top surface and storing process liquid therein; a holding part 3 for holding a substrate W having a processing object surface Wa so as to close the opening 2a by directing the reservoir part 2 to the processing object surface Wa; and a supply part 5 for supplying the process liquid to a position in the reservoir part 2, which is in contact with the processing object surface Wa of the substrate W held by the holding part 3.</p> |
申请公布号 |
JP2015037126(A) |
申请公布日期 |
2015.02.23 |
申请号 |
JP20130168403 |
申请日期 |
2013.08.13 |
申请人 |
SHIBAURA MECHATRONICS CORP |
发明人 |
MATSUSHIMA DAISUKE;DEMURA KENSUKE;SUZUKI MASAFUMI;SASAHIRA KONOSUKE |
分类号 |
H01L21/027;H01L21/304;H01L21/306 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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