| 摘要 |
FIELD: physics.SUBSTANCE: invention relates to electronic engineering. In a lead frame for a multichip semiconductor microwave device, comprising at least two leads each with external and internal ends, the external ends of the leads are connected to a process frame, the internal ends of each lead have a configuration which corresponds to the configuration of contact pads of the chip of the semiconductor device, and are intended for direct connection with the latter. The internal ends of each lead are made and grouped according to the configuration of the contact pads of at least two chips of the semiconductor device, wherein said groups of internal ends of leads lie at a distance from each other, which enables to arrange the chips of the semiconductor device with spacing of not more than 5 mm, said groups of internal ends of leads, intended for connecting single-function leads of chips of the semiconductor device, are connected to one external end of the lead of said groups of internal ends.EFFECT: broader functional capabilities, reduced manufacturing labour input, high reproducibility and improved electrical characteristics.4 cl, 1 dwg |
