OPTOELECTRONIC CHIP-ON-BOARD MODULE

摘要

A method is proposed for coating an optoelectronic chip-on-board module including a flat substrate populated with one or more optoelectronic components having at least one primary optical arrangement and optionally at least one secondary optical arrangement. The optoelectronic chip-on-board module is coated with a transparent, UV-resistant, and temperature-resistant coating made of silicone by the following steps: (a) casting a liquid silicone into a mold open towards the top and having outer dimensions corresponding to or exceeding outer dimensions of the substrate; (b) inserting the substrate into the mold, wherein the optoelectronic component(s) are immersed completely into the silicone and a surface of the substrate contacts the silicone completely or the substrate immerses into the silicone at least partially with full surface contact; (c) curing and cross-linking the silicone with the optoelectronic component(s) and the substrate; and (d) removing the substrate from the mold with the coating of cured silicone.

主权项

1. An optoelectronic chip-on-board module comprising a flat substrate populated with at least one optoelectronic component, the module having a transparent, UV-resistant, and temperature-resistant coating made of a silicone, wherein a surface of the substrate populated with the at least one optoelectronic component is coated with the silicone without a margin.