发明名称 PACKAGING MATERIAL FOR MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a packaging material for molding which has good slipperiness and is excellent in moldability and wear resistance and also excellent in chemical resistance, solvent resistance, and printability.SOLUTION: A packaging material 1 for molding includes: an outer base material layer 13 made of a heat-resistant resin; an inner sealant layer 16; a metal foil layer 11 disposed between the outer base material layer 13 and the inner sealant layer 16; and a matte coat layer 14 formed on the side opposite to the metal foil layer 11 side of the outer base material layer 13. The matte coat layer 14 contains a resin component, solid fine particles, and a lubricant. The inner sealant layer 16 contains a thermoplastic resin and a lubricant.
申请公布号 JP2015033828(A) 申请公布日期 2015.02.19
申请号 JP20130166872 申请日期 2013.08.09
申请人 SHOWA DENKO PACKAGING CO LTD 发明人 NANBORI YUJI;WANG HONGLIN
分类号 B32B15/08;B29C51/14 主分类号 B32B15/08
代理机构 代理人
主权项
地址