发明名称 |
Rapid Thermal Processing Chamber with Micro-Positioning System |
摘要 |
Methods and apparatus for rapid thermal processing of a planar substrate including axially aligning the substrate with a substrate support or with an empirically determined position are described. The methods and apparatus include a sensor system that determines the relative orientations of the substrate and the substrate support. |
申请公布号 |
US2015050118(A1) |
申请公布日期 |
2015.02.19 |
申请号 |
US201414529848 |
申请日期 |
2014.10.31 |
申请人 |
Applied Materials, Inc. |
发明人 |
Sorabji Khurshed;Ranish Joseph M.;Aderhold Wolfgang;Hunter Aaron M.;Koelmel Blake R.;Lerner Alexander N.;Merry Nir |
分类号 |
H01L21/67;H01L21/687;H01L21/324;H01L21/68 |
主分类号 |
H01L21/67 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method of processing a substrate, comprising:
transferring a planar substrate having an edge into a processing chamber onto an intermediate substrate support; transmitting a reflective light beam from one sensor through a space between the substrate and a second substrate support; determining a theta adjustment value for axially aligning the substrate relative to the second substrate support; adjusting a position of the substrate relative to the second substrate support using the theta adjustment value so that the substrate and the second substrate support are substantially in axial alignment; and transferring the substrate to the second substrate support. |
地址 |
Santa Clara CA US |