发明名称 Rapid Thermal Processing Chamber with Micro-Positioning System
摘要 Methods and apparatus for rapid thermal processing of a planar substrate including axially aligning the substrate with a substrate support or with an empirically determined position are described. The methods and apparatus include a sensor system that determines the relative orientations of the substrate and the substrate support.
申请公布号 US2015050118(A1) 申请公布日期 2015.02.19
申请号 US201414529848 申请日期 2014.10.31
申请人 Applied Materials, Inc. 发明人 Sorabji Khurshed;Ranish Joseph M.;Aderhold Wolfgang;Hunter Aaron M.;Koelmel Blake R.;Lerner Alexander N.;Merry Nir
分类号 H01L21/67;H01L21/687;H01L21/324;H01L21/68 主分类号 H01L21/67
代理机构 代理人
主权项 1. A method of processing a substrate, comprising: transferring a planar substrate having an edge into a processing chamber onto an intermediate substrate support; transmitting a reflective light beam from one sensor through a space between the substrate and a second substrate support; determining a theta adjustment value for axially aligning the substrate relative to the second substrate support; adjusting a position of the substrate relative to the second substrate support using the theta adjustment value so that the substrate and the second substrate support are substantially in axial alignment; and transferring the substrate to the second substrate support.
地址 Santa Clara CA US